JPH0353786B2 - - Google Patents
Info
- Publication number
- JPH0353786B2 JPH0353786B2 JP60027843A JP2784385A JPH0353786B2 JP H0353786 B2 JPH0353786 B2 JP H0353786B2 JP 60027843 A JP60027843 A JP 60027843A JP 2784385 A JP2784385 A JP 2784385A JP H0353786 B2 JPH0353786 B2 JP H0353786B2
- Authority
- JP
- Japan
- Prior art keywords
- node
- substrate
- buried
- flip
- diffusion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 239000012535 impurity Substances 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000005669 field effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 32
- 238000009792 diffusion process Methods 0.000 description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- 229920005591 polysilicon Polymers 0.000 description 10
- 239000013078 crystal Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/15—Static random access memory [SRAM] devices comprising a resistor load element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
Landscapes
- Semiconductor Memories (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60027843A JPS61187362A (ja) | 1985-02-15 | 1985-02-15 | 半導体集積回路装置 |
US06/829,897 US4780751A (en) | 1985-02-15 | 1986-02-18 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60027843A JPS61187362A (ja) | 1985-02-15 | 1985-02-15 | 半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61187362A JPS61187362A (ja) | 1986-08-21 |
JPH0353786B2 true JPH0353786B2 (en]) | 1991-08-16 |
Family
ID=12232196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60027843A Granted JPS61187362A (ja) | 1985-02-15 | 1985-02-15 | 半導体集積回路装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4780751A (en]) |
JP (1) | JPS61187362A (en]) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5293563A (en) * | 1988-12-29 | 1994-03-08 | Sharp Kabushiki Kaisha | Multi-level memory cell with increased read-out margin |
US5219779A (en) * | 1989-05-11 | 1993-06-15 | Sharp Kabushiki Kaisha | Memory cell for dynamic random access memory |
JP3214004B2 (ja) * | 1991-12-17 | 2001-10-02 | ソニー株式会社 | 半導体メモリ装置及びその製法 |
JPH0766671B2 (ja) * | 1992-12-09 | 1995-07-19 | 宮城工業高等専門学校長 | 多値置数電子装置 |
KR100305123B1 (ko) * | 1992-12-11 | 2001-11-22 | 비센트 비.인그라시아, 알크 엠 아헨 | 정적랜덤액세스메모리셀및이를포함하는반도체장치 |
US5452246A (en) * | 1993-06-02 | 1995-09-19 | Fujitsu Limited | Static semiconductor memory device adapted for stabilization of low-voltage operation and reduction in cell size |
US5572460A (en) * | 1993-10-26 | 1996-11-05 | Integrated Device Technology, Inc. | Static random-access memory cell with capacitive coupling to reduce sensitivity to radiation |
JP2601176B2 (ja) * | 1993-12-22 | 1997-04-16 | 日本電気株式会社 | 半導体記憶装置 |
US5861652A (en) * | 1996-03-28 | 1999-01-19 | Symbios, Inc. | Method and apparatus for protecting functions imbedded within an integrated circuit from reverse engineering |
US5700707A (en) * | 1996-06-13 | 1997-12-23 | Chartered Semiconductor Manufacturing Pte Ltd. | Method of manufacturing SRAM cell structure having a tunnel oxide capacitor |
US5886921A (en) * | 1996-12-09 | 1999-03-23 | Motorola, Inc. | Static random access memory cell having graded channel metal oxide semiconductor transistors and method of operation |
US6489952B1 (en) * | 1998-11-17 | 2002-12-03 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix type semiconductor display device |
AU2001286206A1 (en) | 2000-09-13 | 2002-03-26 | Teijin Limited | Thick and thin polyester multifilament yarn |
US6366493B1 (en) * | 2000-10-24 | 2002-04-02 | United Microelectronics Corp. | Four transistors static-random-access-memory cell |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5644194A (en) * | 1979-09-19 | 1981-04-23 | Toshiba Corp | Memory device |
JPH0636423B2 (ja) * | 1982-06-22 | 1994-05-11 | 株式会社日立製作所 | 三次元構造半導体装置 |
US4488348A (en) * | 1983-06-15 | 1984-12-18 | Hewlett-Packard Company | Method for making a self-aligned vertically stacked gate MOS device |
US4656731A (en) * | 1985-08-05 | 1987-04-14 | Texas Instruments Incorporated | Method for fabricating stacked CMOS transistors with a self-aligned silicide process |
-
1985
- 1985-02-15 JP JP60027843A patent/JPS61187362A/ja active Granted
-
1986
- 1986-02-18 US US06/829,897 patent/US4780751A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4780751A (en) | 1988-10-25 |
JPS61187362A (ja) | 1986-08-21 |
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